Semiconductor / Battery
WLP(Wafer Level Package) AOI
Next-Generation Wafer-Level Package Inspection Equipment with Integrated 2D/3D Optics
We provide high-precision AOI equipment designed to relably detect
micro-scale defects in wafer-level packaging processes. By combining
optimized lighting with AI-based deep learning, the system enhances
detection performance and improves yield through integrated inspection workflows.
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Precision optical inspection of 2D/3D defects in wafer-level packaging processes
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Advanced inspection logic for RDL(redistribution layer) patterns and bump height/shape
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Enhanced image contrast and improved detection of fine defect through optimized lighting
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AI-based real-time defect classification and inspection decision-making
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High-speed processing and reliable data performance for semiconductor production lines
Battery inspection equipment
End-to-End Quality Assurance with Integrated Control and 2D/2.5D/3D High-Speed Optical Inspection
We provide high-speed inspection equipment optimized for every stage of battery manufacturing, from electrode processing to final module
and pack assembly. By integrating 2D AOI, 2.5D(Photometric Stereo), 3D profiling, and AI-based analysis, the system enables
precise defect detection and improved production yield.
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Electrode Process : High-speed surface inspection for contamination, pinholes, stains, and scratches
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Cell Assembly Process : Precision inspection of alignment, dimensions, step height, and 3D shape(2.5D/3D)
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Welding&Sealing Process : Combined 2D and 2.5D inspection for weld quality, shape anomalies, and surface defects
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Module & Pack Process : Inspection of cell height, flatness, spacing variation, and key assembly features
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Line Integration : PLC/MES integration, image and log data traceability, and AI-based automated classification
